A fully integrated part of the AVI platform across SP700 Series platforms, is the ability to automatically dispense solder paste onto the stencil.
This option provides users with the security of never having a PCB commence the print process without enough paste being available. With the all pressures in a modern manufacturing operation, it’s important to ensure that the simple things are not overlooked!
The dispense option is linked to the stencil bead inspection feature, which comes as standard within Speedprint SP700 Series machines, and is fully retrofittable across that range.
Fully programmable, the user can program the size and inspection intervals to ensure that the correct replenishment program is maintained. Mounted to the printhead, the dispenser will then replenish a bead of paste in the correct position on the stencil.